Bonding pad structure for a display device and fabrication method thereof

ABSTRACT

A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a second conductive layer is formed overlying the protection layer. An opening structure penetrates the second conductive layer and the protection layer to expose the first conductive layer. A third conductive layer is formed overlying the second conductive layer to contact the sidewall and bottom of the opening structure. Thus, the third conductive layer is electrically connected to the second conductive layer to provide a first electrical-connection path, and the third conductive layer is electrically connected to the first conductive layer to provide a second electrical-connection path.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of pending U.S. patent application Ser.No. 10/891,921, filed Jul. 15, 2004 and entitled “Bonding Pad StructureFor A Display Device And Fabrication Method Thereof” (the contents ofwhich are incorporated by reference), which claimed the benefit ofTaiwan application 92127277, filed Oct. 2, 2003.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a display device, and more particularly to aliquid crystal display (LCD) device with a bonding pad structure forelectrically connecting external driving devices. An opening structuredesign on the bonding pad structure can provide an auxiliaryelectrical-connection path to replace a failed electrical-connectionpath caused by a defective conductive layer.

2. Description of the Related Art

Liquid crystal display (LCD) device is the most popular flat paneldisplay and has characteristics of low power consumption, thin profile,light weight and low driving voltage. Generally, the LCD device has anarray of pixel areas defined by scanning lines and data lines, and eachpixel area has a pixel electrode and a thin film transistor (TFT)serving as a switching device. In addition, a plurality of bonding padstructures is fabricated on the terminals of the scanning lines and thedata lines respectively to be electrically connected to external drivingICs through TAB (tape automatic bonding) or FPCB (flexible print circuitboard) techniques, thus driving the pixel electrodes and providing imagesignals.

FIG. 1 is a plane view of a conventional LCD device. An LCD device 10comprises a TFT substrate 12, a CF (color filter) substrate 14 and aliquid crystal material filling in a space between the substrates 12 and14. A plurality of bonding pad structures is formed at the peripheralregion of the TFT substrate 12 to be electrically connected to anexternal IC board 18 through a signal processing substrate 16, such as aTAB substrate or a FPCB.

FIG. 2 is a plane view of the TFT substrate 12 with bonding pads. TheTFT substrate 12 comprises a plurality of scanning lines 20 and datalines 22 which vertically intersect to define an array of pixel areas24. Each scanning line 20 has a terminal portion 20 a, and a bonding pad26 is formed overlying and electrically connected to the terminalportion 20 a, thus the bonding pad 26 can be electrically connected tothe external IC board 18 through the signal processing substrate 16.Similarly, each data line 22 has a terminal portion 22 a, and a bondingpad 26 is formed overlying and electrically connected to the terminalportion 22 a, thus the bonding pad 26 can be electrically connected tothe external IC board 18 through the signal processing substrate 16.

FIG. 3 is a cross-section along line 3-3 of FIG. 2 to illustrate anexample of a conventional bonding pad structure. On the peripheralregion of the TFT substrate 12, a first metal layer M1 is patterned asthe terminal portion 20 a, a protection layer 25 is formed overlying thefirst metal layer M1 and has an opening to expose a predeterminedelectrical-connection area of the terminal portion 20 a, and an ITO(indium tin oxide) layer is patterned as the bonding pad 26 to beelectrically connected to the terminal portion 20 a through the openingof the protection layer 25. Additionally, the first metal layer M1 ispatterned as the scanning lines 20, and the ITO layer is patterned aspixel electrodes.

FIG. 4 is a cross-section along line 4-4 of FIG.2 to illustrate anexample of a conventional bonding pad structure. On the peripheralregion of the TFT substrate 12, a first metal layer M1 is patterned asthe scanning line 20, a protection layer 25 is formed overlying thefirst metal layer M1, a second metal layer M2 is formed overlying theprotection layer 25 and patterned as the terminal portion 22 a, and anITO (indium tin oxide) layer is patterned as a bonding pad 26 to beelectrically connected to the terminal portion 22 a. The second metallayer M2 is also patterned as the data lines 22, and the ITO layer ispatterned as pixel electrodes.

FIG. 5 is a cross-section illustrating the conventional bonding padstructure of FIG. 4 electrically connected to the external IC board. InTAB or FPC processing, when defects are found and in need of repair, theTAB film or FPC film is stripped off, and then the glue of ananisotropic conductive film (ACF) 17 remaining on the glass is cleanedoff, and then a new TAB film or FPC film is pasted on the glasssubstrate. The metal layers, however, may be scratched by improperoperation during cleaning the remaining glue, subsequent testing stepsor improper manual procedures. When the scratched portion 19 is largeenough to crosscut the metal layer, the conductive particles of the ACF17 adjacent to the scratched portion 19 encounter a problem ofinsufficient contact area. Thus, the electrical-connection path shown byan arrow dotted line fails to pass through the scratched portion 19,causing poor reliability and flawed product.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide a bondingpad structure with an opening design for a liquid crystal display (LCD)device in order to provide an auxiliary electrical-connection path toreplace a failed electrical-connection path caused by a defectiveconductive line.

According to the object of the invention, a first conductive layer isformed overlying a substrate, a protection layer is formed overlying thesubstrate and the first conductive layer, and a second conductive layeris formed overlying the protection layer. An opening structurepenetrates the second conductive layer and the protection layer toexpose the first conductive layer. A third conductive layer is formedoverlying the second conductive layer to contact the sidewall and bottomof the opening structure. Thus, the third conductive layer iselectrically connected to the second conductive layer to provide a firstelectrical-connection path, and the third conductive layer iselectrically connected to the first conductive layer to provide a secondelectrical-connection path.

DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from thedetailed description given hereinbelow and the accompanying drawings,given by way of illustration only and thus not intended to be limitativeof the present invention.

FIG. 1 is a plane view of a conventional LCD device.

FIG. 2 is a plane view of the TFT substrate shown in FIG. 1.

FIG. 3 is a cross-section along line 3-3 of FIG. 2 to illustrate anexample of a conventional bonding pad structure.

FIG. 4 is a cross-section along line 4-4 of FIG. 2 to illustrate anexample of a conventional bonding pad structure.

FIG. 5 is a cross-section illustrating the conventional bonding padstructure of FIG. 4 electrically connected to the external IC board.

FIG. 6 is a plane view of a bonding pad structure according to the firstembodiment of the present invention.

FIG. 7 is a cross-section along line 7-7 of FIG. 6 illustrating abonding pad structure according to the first embodiment of the presentinvention.

FIG. 8 is a cross-section along line 8-8 of FIG. 6 illustrating thebonding pad structure electrically connected to an external IC boardthrough a signal processing substrate.

FIG. 9 is a plane view illustrating an example of bonding pad structuresaccording to the second embodiment of the present invention.

FIG. 10 is a plane view illustrating an example of bonding padstructures according to the second embodiment of the present invention.

FIG. 11A is a plane view illustrating an example of bonding padstructures according to the second embodiment of the present invention.

FIG. 11B is a cross-section along line 11-11 of FIG. 11A illustratingthe bonding pad structure according to the second embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is a display device with a bonding pad structureelectrically connected to an external driving device. An openingstructure design on the bonding pad structure can provide an auxiliaryelectrical-connection path to replace a failed electrical-connectionpath caused by a defective conductive layer. The bonding pad structurecan be applied to an LCD (liquid crystal display) device or an OLED(organic electro-luminescent display) device. The bonding pad structureis formed on the terminal of a scanning line, a data line or thecombination thereof.

First Embodiment

FIG. 6 is a plane view of a bonding pad structure according to the firstembodiment of the present invention. A display substrate 30 comprises aplurality of scanning lines 32 extending along a first direction and aplurality of data lines 34 extending along a second direction, whichintersect to define an array of pixel areas 36. Each pixel area 36comprises a switching device (such as a TFT device) and a pixelelectrode. Each scanning line 32 has a terminal portion on which abonding pad 38 is formed and electrically connected to an external ICboard through a signal processing substrate. Similarly, each data line34 has a terminal portion on which a bonding pad 38 is formed andelectrically connected to an external IC board through a signalprocessing substrate. In addition, an opening structure 40 is designedbeneath each bonding pad 38 to make the bonding pad 38 contact twoconductive layers simultaneously, resulting in two electrical-connectionpaths.

FIG. 7 is a cross-section along line 7-7 of FIG. 6 illustrating abonding pad structure according to the first embodiment of the presentinvention. On the peripheral region of the display substrate 30, thebonding pad structure comprises a first conductive layer 42, a firstprotection layer 44, a second conductive layer 46, a second protectionlayer 48 and a third conductive layer 50. A fabrication method for thebonding pad structure is described below. The first conductive layer 42is deposited on the display substrate 30, and then patterned as thescanning lines 32 and the terminal portions thereof by lithography andetching. Then, the first protection layer 44 is deposited on the displaysubstrate 30 to cover the first conductive layer 42. Next, the secondconductive layer 46 is deposited on the first protection layer 44 andthen patterned as the data lines 34 and the terminal portions thereof bylithography and etching. Next, using lithography and etching, theopening structure 40 is formed to penetrate the second conductive layer46 and the first protection layer 44, thus exposing a predeterminedelectrically connecting area of the first conductive layer 42. Next, thesecond protection layer 48 is deposited to cover the second conductivelayer 46 and the first protection layer 44, and then the secondprotection layer 48 remaining in the opening structure 40 and on the topof the second conductive layer 46 is removed by an etching back process.Finally, the third conductive layer 50 is conformally deposited, andthen patterned as the bonding pad 38 and the pixel electrode bylithography and etching. The third conductive layer 50 contacts thebottom and sidewalls of the opening structure 40, thus the bonding pad38 is electrically connected to the second conductive layer 46 toprovide a first electrical-connection path, and the bonding pad 38 iselectrically connected to the first conductive layer 42 to provide asecond electrical-connection path. Preferably, the third conductivelayer 50 is a transparent conductive layer, such as an ITO layer.

FIG. 8 is a cross-section along line 8-8 of FIG. 6 illustrating thebonding pad structure electrically connected to an external IC boardthrough a signal processing substrate. In TAB or FPC processing, thebonding structure fabricated on the peripheral region of the displaysubstrate 30 is connected to an external IC board 54 through a signalprocessing substrate 52 (such as a TAB substrate or a FPCB). Also, aconductive adhesion film 56 (such as an anisotropic conductive film) isemployed to simultaneously achieve adhesion and electrical connectionbetween the bonding pad 38 and the signal processing substrate 52.Similarly, the conductive adhesion film 56 is employed to simultaneouslyachieve adhesion and electrical connection between the external IC board54 and the signal processing substrate 52.

When defects are found and in need of repair, the TAB film or FPC filmis stripped off, and then the remaining glue of the conductive adhesionfilm 56 is cleaned off, and then a new TAB film or FPC film is pastedthereon. However, the second conductive layer 46 may be scratched byimproper operation during cleaning the remaining glue, subsequenttesting steps or improper manual procedures. When the scratched portion58 is large enough to crosscut the second conductive layer 46, theconductive particles of the conductive adhesion film 56 adjacent to thescratched portion 58 lack sufficient contact area, thus failing thefirst electrical-connection path I. Comparatively, in the presentinvention, the third conductive layer 50 can contact the first metallayer 42 through the opening structure 40 to provide the secondelectrical-connection path II as an auxiliary electrical-connection pathwhich replaces the first electrical-connection path I, thus preventingshort circuits and increasing product reliability. Also, the firstprotection layer 44 sandwiched between the first conductive layer 42 andthe second conductive layer 44 can increase structural strength adjacentto the opening structure 40 to ensure the conductivity of the thirdconductive layer 50.

Second Embodiment

The bonding pad structure and the fabrication method thereof in thesecond embodiment are substantially similar to those of the firstembodiment, and similar portions omitted herein. The different portionis the profile and number of the opening structure 40. In each bondingpad structure of the first embodiment, the opening structure 40 is onevia. In each bonding pad structure of the second embodiment, the openingstructure 40 may be a plurality of vias, a strip trench or a circuittrench.

FIGS. 9, 10 and 11A are plane views illustrating examples of bonding padstructures according to the second embodiment of the present invention.FIG. 11B is a cross-section along line 11-11 of FIG. 11A illustratingthe bonding pad structure according to the second embodiment of thepresent invention.

In FIG. 9, each opening structure 40 comprises at least two vias, andthe diameter, symmetry and arrangement of the vias are not limited.

In FIG. 10, each opening structure 40 comprises at least one striptrench, and the length, width, extending direction and number of thestrip trench are not limited.

In FIGS. 11A and 11B, each opening structure 40 comprises at least oneenclosed circuit trench which surrounds the periphery of the bonding padstructure, and the width and profile of the enclosed circuit trench arenot limited.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

1. A fabrication method for a bonding pad structure of a display device,comprising the steps of: providing a substrate; forming a firstconductive layer overlying the substrate; forming a protection layeroverlying the substrate and the first conductive layer; forming a secondconductive layer overlying the protection layer; forming an openingstructure penetrating the second conductive layer and the protectionlayer to expose the first conductive layer; and forming a thirdconductive layer overlying the second conductive layer to contact thesidewall and bottom of the opening structure; wherein, the thirdconductive layer is electrically connected to the second conductivelayer to provide a first electrical-connection path; wherein, the thirdconductive layer is electrically connected to the first conductive layerto provide a second electrical-connection path; and wherein the thirdconductive layer is a transparent conductive layer or an ITO layer. 2.The fabrication method for a bonding pad structure of a display deviceas claimed in claim 1, wherein the opening structure comprises one via.3. The fabrication method for a bonding pad structure of a displaydevice as claimed in claim 1, wherein the opening structure comprises aplurality of vias.
 4. The fabrication method for a bonding pad structureof a display device as claimed in claim 1, wherein the opening structurecomprises at least one strip trench.
 5. The fabrication method for abonding pad structure of a display device as claimed in claim 1, whereinthe opening structure comprises at least one enclosed circuit trench. 6.The fabrication method for a bonding pad structure of a display deviceas claimed in claim 1, wherein the third conductive layer is a bondingpad which is connected to an external IC board through a signalprocessing substrate.
 7. The fabrication method for a bonding padstructure of a display device as claimed in claim 6, wherein the signalprocessing substrate is a TAB (tape automatic bonding) substrate or aFPCB (flexible printed circuit board).
 8. The fabrication method for abonding pad structure of a display device as claimed in claim 6, whereina conductive adhesion film is formed between the third conductive layerand the signal processing substrate.
 9. The fabrication method for abonding pad structure of a display device as claimed in claim 8, whereinthe conductive adhesion film is an anisotropic conductive film (ACF).10. A fabrication method for a bonding pad structure of a displaydevice, comprising the steps of: providing a substrate having aplurality of scan lines and data lines; forming a first conductive layeroverlying the substrate; forming a protection layer overlying thesubstrate and the first conductive layer; forming a second conductivelayer overlying the protection layer; forming an opening structurepenetrating the second conductive layer and the protection layer toexpose the first conductive layer; and forming a third conductive layeroverlying the second conductive layer to contact the sidewall and bottomof the opening structure; wherein, the third conductive layer iselectrically connected to the second conductive layer to provide a firstelectrical-connection path; wherein, the third conductive layer iselectrically connected to the first conductive layer to provide a secondelectrical-connection path; and wherein, the first electrical-connectionpath and the second electrical-connection path electrically connect thethird conductive layer and the data lines or scan lines.
 11. Thefabrication method for a bonding pad structure of a display device asclaimed in claim 10, wherein the opening structure comprises one via.12. The fabrication method for a bonding pad structure of a displaydevice as claimed in claim 10, wherein the opening structure comprises aplurality of vias.
 13. The fabrication method for a bonding padstructure of a display device as claimed in claim 10, wherein theopening structure comprises at least one strip trench.
 14. Thefabrication method for a bonding pad structure of a display device asclaimed in claim 10, wherein the opening structure comprises at leastone enclosed circuit trench.
 15. The fabrication method for a bondingpad structure of a display device as claimed in claim 10, wherein thethird conductive layer is a transparent conductive layer or an ITOlayer.
 16. The fabrication method for a bonding pad structure of adisplay device as claimed in claim 10, wherein the third conductivelayer is a bonding pad which is connected to an external IC boardthrough a signal processing substrate.
 17. The fabrication method for abonding pad structure of a display device as claimed in claim 10,wherein the signal processing substrate is a TAB (tape automaticbonding) substrate or a FPCB (flexible printed circuit board).
 18. Thefabrication method for a bonding pad structure of a display device asclaimed in claim 10, wherein a conductive adhesion film is formedbetween the third conductive layer and the signal processing substrate.19. The fabrication method for a bonding pad structure of a displaydevice as claimed in claim 18, wherein the conductive adhesion film isan anisotropic conductive film (ACF).